Electronic device comprising electronic component arrangement structure

ABSTRACT

According to various embodiments, an electronic device comprises: a first housing including a first space formed through a first side member comprising a first side, a second side extending in a direction perpendicular to the first side, and a third side extending from the second side in parallel with the first side; a second housing slidably coupled to the first housing along a first direction and comprising a second space formed through a second side member; a bendable support connected to the first housing, is, in a slide-in state, at least partially accommodated into the second space, and in a slide-out state, forms a side at least partially coplanar with the first housing; a flexible display supported through the first housing and the bendable support; at least one electronic component disposed in the second space and in communication with an external environment through a first opening formed in at least a portion of the second side member in the slide-in state; and a bendable electrical connection member configured to connect the electronic component to the first space, wherein in the slide-in state, at least a portion of the first side and the third side are accommodated in the second space so as not to be visible from the outside, and the at least one electronic component may be disposed at a position not interfered with by the first side and/or the second side in the slide-in state.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of International Application No.PCT/KR2021/008279 designating the United States, filed on Jun. 30, 2021,in the Korean Intellectual Property Receiving Office and claimingpriority to Korean Patent Application No. 10-2020-0086795, filed on Jul.14, 2020, in the Korean Intellectual Property Office, and to KoreanPatent Application No. 10-2020-0187320, filed on Dec. 30, 2020, in theKorean Intellectual Property Office, the disclosures of all of which areincorporated by reference herein in their entireties.

BACKGROUND Field

The disclosure relates to an electronic device including an electroniccomponent arrangement structure.

Description of Related Art

Electronic devices are gradually becoming slimmer, and are beingimproved to increase their rigidity, strengthen their design aspects,and differentiate their functional features. The electronic device isbeing developed to have various shapes, departing from a uniformrectangular shape. The electronic device may have a deformable structurethat provides high portability and also provides a large-screen displayin use. In connection with such a deformable structure, the electronicdevice may have a structure (e.g., a rollable structure or a slidablestructure) capable of varying the display area of a flexible displaythrough support of housings that slide with respect to each other. Thiselectronic device may have an arrangement structure of electroniccomponents in consideration of a combining structure of housings thatoperate in a sliding manner.

The electronic device may include a deformable slidable electronicdevice (e.g., a rollable electronic device) capable of expanding adisplay area. The slidable electronic device may include a first housing(e.g., a first housing structure, a base housing, a base bracket, or abase structure) and a second housing (e.g., a second housing structure,a slide housing, a slide bracket, or a slide structure) which can befitted together at least in part and flexibly combined with each other.For example, the first housing and the second housing operate to beslidable with respect to each other and support at least a part of aflexible display (or expandable display), thereby enabling the flexibledisplay to have a first display area in a slide-in state and to have asecond display area greater than the first display area in a slide-outstate.

The slidable electronic device may include a plurality of electroniccomponents disposed in an inner space. Because these electroniccomponents require different mounting spaces, it may be difficult toarrange them in the inner space of housings that slide with respect toeach other. For example, electronic components that perform theirfunctions by being connected to the outside may be disposed in the innerspace of the electronic device at a position corresponding to at leastone opening formed in the housings.

However, these electronic components may not fully perform theirfunctions due to an assembly tolerance or a gap between two housingsthat perform the sliding operation. For example, in the case that theelectronic components include a speaker or a receiver, sound generatedfrom the speaker may not be properly transmitted to the outside due to aphenomenon, such as a sound leak, by an assembly tolerance or gapbetween two housings.

SUMMARY

Embodiments of the disclosure may provide an electronic device includingan electronic component arrangement structure.

Embodiments of the disclosure provide an electronic device including anarrangement structure of electronic components that can perform theirfunctions regardless of a sliding operation.

Embodiments of the disclosure provide an electronic device including anelectronic component arrangement structure that can be firmly supportedin an inner space of a housing.

According to various example embodiments, an electronic device includes:a first housing having a first space formed through a first lateralportion including a first side surface, a second side surface extendingin a direction perpendicular to the first side surface, and a third sidesurface extending from the second side surface and parallel to the firstside surface; a second housing slidably combined with the first housingalong a first direction and having a second space formed through asecond lateral portion; a bendable support connected to the firsthousing, accommodated at least in part in the second space in a slide-instate, and coplanar at least in part with the first housing in aslide-out state; a flexible display including a first portion disposedto be visible from outside in the slide-in state, and a second portionextending from the first portion and accommodated in the second spacethrough the bendable support so as not to be visible at least in partfrom the outside; at least one electronic component disposed in thesecond space and communicating with an external environment through afirst opening formed in at least a part of the second lateral portion inthe slide-in state; and a bendable electrical connection membercomprising a conductor connecting the electronic component to the firstspace. At least a part of the first and third side surfaces may beaccommodated in the second space in the slide-in state so as not to bevisible from the outside, and the at least one electronic component maybe disposed at a position not subject to interference from the firstside surface and/or the second side surface in the slide-in state.

According to various example embodiments of the disclosure, theelectronic device includes at least one electronic component, which isdisposed in the inner space of the second housing which is not subjectto interference from the sliding operation of the first housing even inthe slide-in state, and also electrically connected to the first housingthrough the FPCB. Therefore, it is possible to reduce the performancedegradation of the electronic component due to interference between thetwo housings caused by the sliding operation.

In addition, various effects explicitly or implicitly appreciatedthrough the disclosure may be provided.

BRIEF DESCRIPTION OF THE DRAWINGS

In relation to the description of drawings, the same or similarreference numerals may be used for the same or similar components.Further, the above and other aspects, features and advantages of certainembodiments of the present disclosure will be more apparent from thefollowing detailed description, taken in conjunction with theaccompanying drawings, in which:

FIG. 1 is a block diagram illustrating an example electronic device in anetwork environment according to various embodiments;

FIG. 2A and FIG. 2B are diagrams illustrating a front surface and a rearsurface of an electronic device in a slide-in state, respectively,according to various embodiments;

FIG. 3A and FIG. 3B are diagrams illustrating a front surface and a rearsurface of an electronic device in a slide-out state, respectively,according to various embodiments;

FIG. 4 is an exploded perspective view of an electronic device accordingto various embodiments;

FIG. 5A is a cross-sectional view of the electronic device taken alongline 5 a-5 a of FIG. 2B according to various embodiments;

FIG. 5B is a cross-sectional view of the electronic device taken alongline 5 b-5 b of FIG. 3B according to various embodiments;

FIG. 6 is a partial exploded perspective view of an electronic deviceincluding a slide hinge module according to various embodiments;

FIG. 7A is a diagram illustrating an electronic device having a slidehinge module disposed therein in a slide-in state according to variousembodiments;

FIG. 7B is a diagram illustrating an enlarged view of area 7 b of FIG.7A according to various embodiments;

FIG. 8 is a diagram illustrating an electronic device having a slidehinge module disposed therein in a slide-out state according to variousembodiments;

FIG. 9A and FIG. 9B are diagrams illustrating a slide-in state and aslide-out state of an electronic device including an antenna,respectively, according to various embodiments;

FIG. 10A is a partial perspective view illustrating an inner portion ofa first housing in area 10 a of FIG. 9B according to variousembodiments;

FIG. 10B is an enlarged perspective view illustrating area 10 b of FIG.9B according to various embodiments;

FIG. 10C is a partial cross-sectional view of the first housing takenalong line 10 c-10 c of FIG. 10B according to various embodiments;

FIG. 11A is a partial perspective view of a second housing according tovarious embodiments;

FIG. 11B is a partial cross-sectional view of the second housing takenalong line 11 b-11 b of FIG. 11A according to various embodiments;

FIG. 12A is a diagram illustrating an electrical connection structure ofan antenna in area 12 a of FIG. 9B according to various embodiments;

FIG. 12B is a diagram illustrating an electrical connection structure ofan antenna in area 12 b of FIG. 9B according to various embodiments;

FIG. 12C is a diagram illustrating an electrical connection structure ofan antenna in area 12 c of FIG. 9B according to various embodiments;

FIG. 12D is a partial perspective view illustrating an electricalconnection structure of an antenna in area 12 d of FIG. 9B according tovarious embodiments;

FIG. 13A and FIG. 13B are diagrams illustrating a slide-in state and aslide-out state of an electronic device including an antenna member,respectively, according to various embodiments;

FIG. 14A is a cross-sectional view of the electronic device taken alongline 14 a-14 a of FIG. 13A according to various embodiments;

FIG. 14B is a cross-sectional view of the electronic device taken alongline 14 b-14 b of FIG. 13B according to various embodiments;

FIG. 15A is a perspective view of a first housing showing a componentarrangement structure according to various embodiments;

FIG. 15B is a partial perspective view of an electronic device showing aspeaker arrangement structure according to various embodiments;

FIG. 16A and FIG. 16B are diagrams illustrating a slide-in state and aslide-out state of an electronic device including a speaker,respectively, according to various embodiments;

FIG. 17 is a partial cross-sectional view of the electronic device takenalong line 17-17 of FIG. 16A according to various embodiments;

FIGS. 18A, 18B, 19A and 19B are diagrams illustrating a mountingstructure of a card tray in a slide-in state and a slide-out state of anelectronic device according to various embodiments;

FIG. 20 is an exploded perspective view of a first housing including acomponent assembly according to various embodiments;

FIGS. 21A, 21B and 21C are perspective views illustrating an assemblingoperation of a component assembly according to various embodiments; and

FIG. 22 is a partial cross-sectional view of the electronic device takenalong line 22-22 of FIG. 18A according to various embodiments.

DETAILED DESCRIPTION

FIG. 1 is a block diagram illustrating an example electronic device 101in a network environment 100 according to various embodiments.

Referring to FIG. 1 , the electronic device 101 in the networkenvironment 100 may communicate with an electronic device 102 via afirst network 198 (e.g., a short-range wireless communication network),or at least one of an electronic device 104 or a server 108 via a secondnetwork 199 (e.g., a long-range wireless communication network).According to an embodiment, the electronic device 101 may communicatewith the electronic device 104 via the server 108. According to anembodiment, the electronic device 101 may include a processor 120,memory 130, an input module 150, a sound output module 155, a displaymodule 160, an audio module 170, a sensor module 176, an interface 177,a connecting terminal 178, a haptic module 179, a camera module 180, apower management module 188, a battery 189, a communication module 190,a subscriber identification module (SIM) 196, or an antenna module 197.In various embodiments, at least one of the components (e.g., theconnecting terminal 178) may be omitted from the electronic device 101,or one or more other components may be added in the electronic device101. In various embodiments, some of the components (e.g., the sensormodule 176, the camera module 180, or the antenna module 197) may beimplemented as a single component (e.g., the display module 160).

The processor 120 may execute, for example, software (e.g., a program140) to control at least one other component (e.g., a hardware orsoftware component) of the electronic device 101 coupled with theprocessor 120, and may perform various data processing or computation.According to an embodiment, as at least part of the data processing orcomputation, the processor 120 may store a command or data received fromanother component (e.g., the sensor module 176 or the communicationmodule 190) in volatile memory 132, process the command or the datastored in the volatile memory 132, and store resulting data innon-volatile memory 134. According to an embodiment, the processor 120may include a main processor 121 (e.g., a central processing unit (CPU)or an application processor (AP)), or an auxiliary processor 123 (e.g.,a graphics processing unit (GPU), a neural processing unit (NPU), animage signal processor (ISP), a sensor hub processor, or a communicationprocessor (CP)) that is operable independently from, or in conjunctionwith, the main processor 121. For example, when the electronic device101 includes the main processor 121 and the auxiliary processor 123, theauxiliary processor 123 may be adapted to consume less power than themain processor 121, or to be specific to a specified function. Theauxiliary processor 123 may be implemented as separate from, or as partof the main processor 121.

The auxiliary processor 123 may control at least some of functions orstates related to at least one component (e.g., the display module 160,the sensor module 176, or the communication module 190) among thecomponents of the electronic device 101, instead of the main processor121 while the main processor 121 is in an inactive (e.g., sleep) state,or together with the main processor 121 while the main processor 121 isin an active state (e.g., executing an application). According to anembodiment, the auxiliary processor 123 (e.g., an image signal processoror a communication processor) may be implemented as part of anothercomponent (e.g., the camera module 180 or the communication module 190)functionally related to the auxiliary processor 123. According to anembodiment, the auxiliary processor 123 (e.g., the neural processingunit) may include a hardware structure specified for artificialintelligence model processing. An artificial intelligence model may begenerated by machine learning. Such learning may be performed, e.g., bythe electronic device 101 where the artificial intelligence is performedor via a separate server (e.g., the server 108). Learning algorithms mayinclude, but are not limited to, e.g., supervised learning, unsupervisedlearning, semi-supervised learning, or reinforcement learning. Theartificial intelligence model may include a plurality of artificialneural network layers. The artificial neural network may be a deepneural network (DNN), a convolutional neural network (CNN), a recurrentneural network (RNN), a restricted boltzmann machine (RBM), a deepbelief network (DBN), a bidirectional recurrent deep neural network(BRDNN), deep Q-network or a combination of two or more thereof but isnot limited thereto. The artificial intelligence model may, additionallyor alternatively, include a software structure other than the hardwarestructure.

The memory 130 may store various data used by at least one component(e.g., the processor 120 or the sensor module 176) of the electronicdevice 101. The various data may include, for example, software (e.g.,the program 140) and input data or output data for a command relatedthereto. The memory 130 may include the volatile memory 132 or thenon-volatile memory 134.

The program 140 may be stored in the memory 130 as software, and mayinclude, for example, an operating system (OS) 142, middleware 144, oran application 146.

The input module 150 may receive a command or data to be used by anothercomponent (e.g., the processor 120) of the electronic device 101, fromthe outside (e.g., a user) of the electronic device 101. The inputmodule 150 may include, for example, a microphone, a mouse, a keyboard,a key (e.g., a button), or a digital pen (e.g., a stylus pen).

The sound output module 155 may output sound signals to the outside ofthe electronic device 101. The sound output module 155 may include, forexample, a speaker or a receiver. The speaker may be used for generalpurposes, such as playing multimedia or playing record. The receiver maybe used for receiving incoming calls. According to an embodiment, thereceiver may be implemented as separate from, or as part of the speaker.

The display module 160 may visually provide information to the outside(e.g., a user) of the electronic device 101. The display module 160 mayinclude, for example, a display, a hologram device, or a projector andcontrol circuitry to control a corresponding one of the display,hologram device, and projector. According to an embodiment, the displaymodule 160 may include a touch sensor adapted to detect a touch, or apressure sensor adapted to measure the intensity of force incurred bythe touch.

The audio module 170 may convert a sound into an electrical signal andvice versa. According to an embodiment, the audio module 170 may obtainthe sound via the input module 150, or output the sound via the soundoutput module 155 or a headphone of an external electronic device (e.g.,an electronic device 102) directly (e.g., wiredly) or wirelessly coupledwith the electronic device 101.

The sensor module 176 may detect an operational state (e.g., power ortemperature) of the electronic device 101 or an environmental state(e.g., a state of a user) external to the electronic device 101, andthen generate an electrical signal or data value corresponding to thedetected state. According to an embodiment, the sensor module 176 mayinclude, for example, a gesture sensor, a gyro sensor, an atmosphericpressure sensor, a magnetic sensor, an acceleration sensor, a gripsensor, a proximity sensor, a color sensor, an infrared (IR) sensor, abiometric sensor, a temperature sensor, a humidity sensor, or anilluminance sensor.

The interface 177 may support one or more specified protocols to be usedfor the electronic device 101 to be coupled with the external electronicdevice (e.g., the electronic device 102) directly (e.g., wiredly) orwirelessly. According to an embodiment, the interface 177 may include,for example, a high definition multimedia interface (HDMI), a universalserial bus (USB) interface, a secure digital (SD) card interface, or anaudio interface.

A connecting terminal 178 may include a connector via which theelectronic device 101 may be physically connected with the externalelectronic device (e.g., the electronic device 102). According to anembodiment, the connecting terminal 178 may include, for example, a HDMIconnector, a USB connector, a SD card connector, or an audio connector(e.g., a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanicalstimulus (e.g., a vibration or a movement) or electrical stimulus whichmay be recognized by a user via his tactile sensation or kinestheticsensation. According to an embodiment, the haptic module 179 mayinclude, for example, a motor, a piezoelectric element, or an electricstimulator.

The camera module 180 may capture a still image or moving images.According to an embodiment, the camera module 180 may include one ormore lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to theelectronic device 101. According to an embodiment, the power managementmodule 188 may be implemented as at least part of, for example, a powermanagement integrated circuit (PMIC).

The battery 189 may supply power to at least one component of theelectronic device 101. According to an embodiment, the battery 189 mayinclude, for example, a primary cell which is not rechargeable, asecondary cell which is rechargeable, or a fuel cell.

The communication module 190 may support establishing a direct (e.g.,wired) communication channel or a wireless communication channel betweenthe electronic device 101 and the external electronic device (e.g., theelectronic device 102, the electronic device 104, or the server 108) andperforming communication via the established communication channel. Thecommunication module 190 may include one or more communicationprocessors that are operable independently from the processor 120 (e.g.,the application processor (AP)) and supports a direct (e.g., wired)communication or a wireless communication. According to an embodiment,the communication module 190 may include a wireless communication module192 (e.g., a cellular communication module, a short-range wirelesscommunication module, or a global navigation satellite system (GNSS)communication module) or a wired communication module 194 (e.g., a localarea network (LAN) communication module or a power line communication(PLC) module). A corresponding one of these communication modules maycommunicate with the external electronic device via the first network198 (e.g., a short-range communication network, such as BLUETOOTH,wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA))or the second network 199 (e.g., a long-range communication network,such as a legacy cellular network, a 5G network, a next-generationcommunication network, the Internet, or a computer network (e.g., LAN orwide area network (WAN)). These various types of communication modulesmay be implemented as a single component (e.g., a single chip), or maybe implemented as multi components (e.g., multi chips) separate fromeach other. The wireless communication module 192 may identify andauthenticate the electronic device 101 in a communication network, suchas the first network 198 or the second network 199, using subscriberinformation (e.g., international mobile subscriber identity (IMSI))stored in the subscriber identification module 196.

The wireless communication module 192 may support a 5G network, after a4G network, and next-generation communication technology, e.g., newradio (NR) access technology. The NR access technology may supportenhanced mobile broadband (eMBB), massive machine type communications(mMTC), or ultra-reliable and low-latency communications (URLLC). Thewireless communication module 192 may support a high-frequency band(e.g., the mmWave band) to achieve, e.g., a high data transmission rate.The wireless communication module 192 may support various technologiesfor securing performance on a high-frequency band, such as, e.g.,beamforming, massive multiple-input and multiple-output (massive MIMO),full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, orlarge scale antenna. The wireless communication module 192 may supportvarious requirements specified in the electronic device 101, an externalelectronic device (e.g., the electronic device 104), or a network system(e.g., the second network 199). According to an embodiment, the wirelesscommunication module 192 may support a peak data rate (e.g., 20 Gbps ormore) for implementing eMBB, loss coverage (e.g., 164 dB or less) forimplementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each ofdownlink (DL) and uplink (UL), or a round trip of 1 ms or less) forimplementing URLLC.

The antenna module 197 may transmit or receive a signal or power to orfrom the outside (e.g., the external electronic device) of theelectronic device 101. According to an embodiment, the antenna module197 may include an antenna including a radiating element including aconductive material or a conductive pattern formed in or on a substrate(e.g., a printed circuit board (PCB)). According to an embodiment, theantenna module 197 may include a plurality of antennas (e.g., arrayantennas). In such a case, at least one antenna appropriate for acommunication scheme used in the communication network, such as thefirst network 198 or the second network 199, may be selected, forexample, by the communication module 190 (e.g., the wirelesscommunication module 192) from the plurality of antennas. The signal orthe power may then be transmitted or received between the communicationmodule 190 and the external electronic device via the selected at leastone antenna. According to an embodiment, another component (e.g., aradio frequency integrated circuit (RFIC)) other than the radiatingelement may be additionally formed as part of the antenna module 197.

According to various embodiments, the antenna module 197 may form ammWave antenna module. According to an embodiment, the mmWave antennamodule may include a printed circuit board, a RFIC disposed on a firstsurface (e.g., the bottom surface) of the printed circuit board, oradjacent to the first surface and capable of supporting a designatedhigh-frequency band (e.g., the mmWave band), and a plurality of antennas(e.g., array antennas) disposed on a second surface (e.g., the top or aside surface) of the printed circuit board, or adjacent to the secondsurface and capable of transmitting or receiving signals of thedesignated high-frequency band.

At least some of the above-described components may be coupled mutuallyand communicate signals (e.g., commands or data) therebetween via aninter-peripheral communication scheme (e.g., a bus, general purposeinput and output (GPIO), serial peripheral interface (SPI), or mobileindustry processor interface (MIPI)).

According to an embodiment, commands or data may be transmitted orreceived between the electronic device 101 and the external electronicdevice 104 via the server 108 coupled with the second network 199. Eachof the electronic devices 102 or 104 may be a device of a same type as,or a different type, from the electronic device 101. According to anembodiment, all or some of operations to be executed at the electronicdevice 101 may be executed at one or more of the external electronicdevices 102, 104, or 108. For example, if the electronic device 101should perform a function or a service automatically, or in response toa request from a user or another device, the electronic device 101,instead of, or in addition to, executing the function or the service,may request the one or more external electronic devices to perform atleast part of the function or the service. The one or more externalelectronic devices receiving the request may perform the at least partof the function or the service requested, or an additional function oran additional service related to the request, and transfer an outcome ofthe performing to the electronic device 101. The electronic device 101may provide the outcome, with or without further processing of theoutcome, as at least part of a reply to the request. To that end, acloud computing, distributed computing, mobile edge computing (MEC), orclient-server computing technology may be used, for example. Theelectronic device 101 may provide ultra low-latency services using,e.g., distributed computing or mobile edge computing. In an embodiment,the external electronic device 104 may include an internet-of-things(IoT) device. The server 108 may be an intelligent server using machinelearning and/or a neural network. According to an embodiment, theexternal electronic device 104 or the server 108 may be included in thesecond network 199. The electronic device 101 may be applied tointelligent services (e.g., smart home, smart city, smart car, orhealthcare) based on 5G communication technology or IoT-relatedtechnology.

FIG. 2A and FIG. 2B are diagrams illustrating a front surface and a rearsurface of an electronic device in a slide-in state, respectively,according to various embodiments. FIG. 3A and FIG. 3B are diagramsillustrating a front surface and a rear surface of an electronic devicein a slide-out state, respectively, according to various embodiments.

An electronic device 200 of FIGS. 2A, 2B, 3A and 3B (which may bereferred to as FIGS. 2A to 3B) may be at least partially similar to theelectronic device 101 of FIG. 1 , or may further include variousembodiments of an electronic device.

Referring to FIGS. 2A to 3B, the electronic device 200 may include afirst housing 210 (e.g., a first housing structure or a base housing), asecond housing 220 (e.g., a second housing structure or a slide housing)coupled to be movable from the first housing 210 in a predetermined(e.g., specified) first direction (direction {circle around (1)}) and asecond direction (direction {circle around (2)}) opposite to the firstdirection (direction {circle around (1)}), and a flexible display 230(e.g., an expandable display) disposed to be supported by at least aportion of the first housing 210 and the second housing 220. Accordingto an embodiment, the electronic device 200 may be at least partiallyconnected to at least a portion of the first housing 210 in a slide-outstate and may be at least partially accommodated in the inner space(e.g., a second space 2201 of FIG. 5A) of the second housing 220 in aslide-in state, thereby including a bendable member (or a bendablesupport member, bendable support, etc.) (e.g., a bendable member 240 ofFIG. 5A) (e.g., a multi-joint hinge module) configured to support theflexible display 230. According to an embodiment, at least a portion ofthe flexible display 230 may be accommodated in the inner space (e.g.,the second space 2201 of FIG. 5A) of the second housing 220 in aslide-in state while being supported by the bendable member (e.g., thebendable member 240 of FIG. 5A), and thus may be disposed to preventand/or reduce the portion from being viewed from the outside. Accordingto an embodiment, at least a portion of the flexible display 230 may bedisposed to be visible from the outside in a slide-out state while beingsupported by the bendable member (e.g., the bendable member 240 of FIG.5A) at least partially forming the same plane as the first housing 210.

According to various embodiments, the electronic device 200 may includea front surface 200 a (e.g., a first surface), a rear surface 200 b(e.g., a second surface) facing a direction opposite to the frontsurface 200 a, and a side surface (not shown) surrounding a spacebetween the front surface 200 a and the rear surface 200 b. According toan embodiment, the electronic device 200 may include a first housing 210including a first side surface member 211 and a second housing 220including a second side surface member 221. According to an embodiment,the first side surface member 211 may include a first side surface 2111having a first length along a first direction (direction {circle around(1)}), a second side surface 2112 extending from the first side surface2111 to have a second length greater than the first length along adirection substantially perpendicular to the first side surface, and athird side surface 2113 extending from the second side surface 2112 tobe substantially parallel to the first side surface 2111 and having thefirst length. According to an embodiment, the first side surface member211 may be at least partially configured of a conductive material (e.g.,metal). According to an embodiment, the first side surface member 211may include a first support member 212 extending to at least a portionof the inner space (e.g., a first space 2101 of FIG. 5A) of the firsthousing 210. For example, the first side surface member 211 may beintegrally configured with the first support member 212. For anotherexample, the first support member 212 may be configured separately fromthe first side surface member 211 to be structurally coupled to thefirst side surface member 211.

According to various embodiments, the second side surface member 221 mayinclude a fourth side surface 2211 at least partially corresponding tothe first side surface 2111 and having a third length, a fifth sidesurface 2212 extending from the fourth side surface 2211 in a directionsubstantially parallel to the second side surface 2112 and having afourth length greater than the third length, and a sixth side surface2213 extending from the fifth side surface 2212 to correspond to thethird side surface 2113 and having the third length. According to anembodiment, the second side surface member 221 may be at least partiallyconfigured of a conductive material (e.g., metal). According to anembodiment, at least a portion of the second side surface member 221 mayinclude a second support member 222 extending to at least a portion ofthe inner space (e.g., the second space 2201 of FIG. 5 ) of the secondhousing 220. For example, the second side surface member 221 may beintegrally configured with the second support member 222. For anotherexample, the second support member 222 may be configured separately fromthe second side surface member 221 to be coupled to the second sidesurface member 221. According to an embodiment, the first side surface2111 and the fourth side surface 2211 and/or the third side surface 2113and the sixth side surface 2213 may be coupled to be slidable withrespect to each other. According to an embodiment, at least a portion ofthe first side surface 2111 may overlap at least a portion of the fourthside surface 2211 in a slide-in state, and thus may be disposed toprevent and/or reduce the at least portion of the first side surface2111 from being viewed from the outside. According to an embodiment, atleast a portion of the third side surface 2113 may overlap at least aportion of the sixth side surface 2213 in a slide-in state, and thus maybe disposed to be not visible from the outside. According to anembodiment, in a slide-in state, at least a portion of the first supportmember 212 may overlap the second support member 222 and the restportion of the first support member 212 may be disposed to be visiblefrom the outside. Therefore, the first support member 212 may include anon-overlapping portion 212 a which does not overlap the second supportmember 222 and an overlapping portion 212 b which overlaps the secondsupport member 222 in a slide-in state. In an embodiment, thenon-overlapping portion 212 a and the overlapping portion 212 b may beintegrally configured. In an embodiment, the non-overlapping portion 212a and the overlapping portion 212 b may be separately provided and bestructurally coupled.

According to various embodiments, the first housing 210 may include afirst sub-space A corresponding the non-overlapping portion 212 a and asecond sub-space B corresponding to the overlapping portion 212 b in thefirst space (e.g., the first space 2101 of FIG. 5A). According to anembodiment, the first sub-space A and the second sub-space B may bearranged to be at least partially connected to each other or separatedfrom each other. According to an embodiment, the first sub-space A maybe configured in a shape different from that of the second sub-space B.This may result from the overlapping structure in which the secondsupport member 222 and the first support member 212 overlap each otherin an area corresponding to the second sub-space B. According to anembodiment, the first sub-space A and the second sub-space B may beconfigured to have heights or space volumes different from each other.According to an embodiment, the electronic device 200 may include aplurality of electronic components (e.g., a camera module 216, a sensormodule 217, a flash 218, a main board (e.g., a main board 250 of FIG. 4), or a battery (e.g., a battery 251 of FIG. 4 )) arranged in the firstspace (e.g., the first space 2101 of FIG. 5 ) of the first housing 210.According to an embodiment, the first sub-space A may be used, forexample, as an area in which electronic components (e.g., a cameramodule 216, a sensor module 217, or a flash 218), the operation of whichrequires a comparatively large mounting space, a relatively largemounting thickness, or avoiding an overlapping structure, are arranged.According to an embodiment, the second sub-space B may be used, forexample, as an area in which electronic components (e.g., the main board250 (PCB) of FIG. 4 or a battery (e.g., a battery 251 of FIG. 4 )),which require a comparatively small mounting space or a relatively smallmounting thickness or are operable regardless of an overlappingstructure, are arranged.

According to various embodiments, the front surface 200 a and the rearsurface 200 b of the electronic device 200 may have variable areasaccording to a slide-in state and a slide-out state. In an embodiment,the electronic device 200 may include a first rear surface cover 213disposed in at least a portion of the first housing 210 and a secondrear surface cover 223 disposed on at least a portion of the secondhousing 220 in the rear surface 200 b. According to an embodiment, thefirst rear surface cover 213 and/or the second rear surface cover 223may be arranged to be coupled to at least a portion of the first supportmember 212 and the second support member 213. In an embodiment, thefirst rear surface cover 213 may be configured integrally with the firstside surface member 211. For another example, the second rear surfacecover 223 may be configured integrally with the second side surfacemember 221. According to an embodiment, the first rear surface cover 213and/or the second rear surface cover 223 may be configured of a polymer,coated or colored glass, ceramic, metal (e.g., aluminum, stainless steel(STS), or magnesium), or a combination of at least two of the abovematerials. In an embodiment, the first rear surface cover 213 may extendto at least a portion of the first side surface member 211. In anembodiment, the second rear surface cover 223 may extend to at least aportion of the second side surface member 211. In an embodiment, atleast extending portion of the first side surface member 211 of thefirst rear surface cover 213 may be configured to have a curved surface.In an embodiment, at least extending portion of the second side surfacemember 221 of the second rear surface cover 223 may be configured tohave a curved surface. In an embodiment, at least a portion of the firstsupport member 212 may be substituted by the first rear surface cover213, and at least a portion of the second support member 222 may besubstituted by the second rear surface cover 223.

According to various embodiments, the electronic device 200 may includea first housing 210 and a flexible display 230 disposed to be supportedby at least a portion of a second housing 220. According to anembodiment, the flexible display 230 may include a first portion 230 a(e.g., a flat surface part) which is visible from the outside and asecond portion 230 b (e.g., a bendable part) extending from the firstportion 230 a and at least partially introduced to the inner space(e.g., the first space 2101 in FIG. 5A) of the second housing 220 so asto prevent and/or reduce the second portion 230 b from being viewed fromthe outside in a slide-in state. According to an embodiment, the firstportion 230 a may be disposed to be supported by the first housing 210,and the second portion 230 b may be disposed to be at least partiallysupported by the bendable member (e.g., the bendable member 240 in FIG.5A and FIG. 5B). According to an embodiment, in a state where the firsthousing 210 is slid out along a predetermined first direction (direction{circle around (1)}), at least a portion of the second portion 230 b ofthe flexible display 230 may extend from the first portion 230 a whilebeing supported by the bendable member (e.g., the bendable member 240 ofFIG. 5A), configure substantially the same plane as the first portion230 a, and be disposed to be visible from the outside. According to anembodiment, in a state where the first housing 210 is slid in along apredetermined second direction (direction {circle around (2)}), at leasta portion of the second portion 230 b of the flexible display 230 may beslid in the inner space (e.g., the second space 2201 of FIG. 5A) of thesecond housing 220, and be disposed to prevent and/or reduce the atleast a portion from being viewed from the outside. Therefore, in theelectronic device 200, the display area of the flexible display 230 mayvary as the first housing 210 slides along the predetermined directionfrom the second housing 220.

According to various embodiments, the first housing 210 and the secondhousing 220 may operate in a sliding manner with respect to each otherto allow the total width to be variable. According to an embodiment, theelectronic device 200 may be configured to have a first width W1 fromthe second side surface 2112 to the fourth side surface in a slide-instate. According to an embodiment, in a slide-out state, the electronicdevice 200 may be configured to have a third width W3 greater than thefirst width W1, by allowing a portion of the bendable member (e.g., thebendable member 240 of FIG. 5A) slid in the inner space (e.g., thesecond space 2201 of FIG. 5A) of the second housing 210 to be moved tohave an additional second width W2. For example, the flexible display230 may have a display area substantially corresponding to the firstwidth W1 in a slide-in state, and have an expanded display areasubstantially corresponding to the third width W3 in a slide-out state.

According to various embodiments, a slide-out operation of theelectronic device 200 may be performed by a user's operation. Forexample, the electronic device 200 may be switched from a slide-in stateto a slide-out state via an operation of the flexible display 230 whichis moved in a predetermined first direction (direction {circle around(1)}) by a user's operation. According to an embodiment, the electronicdevice 200 may be switched from a slide-out state to a slide-in statevia an operation of the flexible display 230 which is moved in apredetermined second direction (direction {circle around (2)}) by auser's operation. According to an embodiment, the electronic device 200may maintain a slide-out state and/or a slide-in state by being pressedin a direction in which the first housing 210 is to be slid in or slidout from the second housing with reference to a predetermined inflectionpoint via a slide hinge module (e.g., a slide hinge module 260 of FIG.5A) disposed between the first housing 210 and the second housing 220.In an embodiment, the electronic device 200 may be configured to allowthe first housing 210 to be slid out in a predetermined first direction(e.g., direction {circle around (1)}) by an operation of a lockerexposed through the rear surface 200 b of the electronic device 200. Inan embodiment, the electronic device 200 may be automatically operatedvia a drive mechanism (e.g., a drive motor, a deceleration module,and/or a gear assembly) disposed in the inner space (e.g., the firstspace 2101 of FIG. 5A) of the first housing 210 and/or the inner space(e.g., the second space 2201 of FIG. 5A) of the second housing 220.According to an embodiment, the electronic device 200 may be configuredto control an operation of the second housing 220 via a drive mechanismvia a processor (e.g., a processor 120 of FIG. 1 ), if an event forswitching of a slide-in and slide-out state of the electronic device 200is detected. In an embodiment, the processor (e.g., the processor 120 ofFIG. 1 ) of the electronic device 200 may control the flexible display230 to display an object in various manners and execute an applicationprogram, in response to the display area of the flexible display 230,the display area having been changed according to a slide-in state, aslide-out state, or an intermediate state (e.g., including anarbitrarily stopped state). For example, an intermediate state may referto a middle state between a slide-in state and a slide-out state. Forexample, a state changing from a slide-in state to a slide-out state maybe called an intermediate state. For another example, a state changefrom a slide-out state to a slide-in state may be called an intermediatestate.

According to various embodiments, the electronic device 200 may includeat least one of an input device 203, sound output devices 206 and 207,sensor modules 204 and 217, camera modules 205 and 216, a connector port208, a key input device 219, or an indicator (not shown). In anembodiment, the electronic device 200 may be configured such that atleast one of the above-described components is omitted or othercomponents are additionally included.

According to various embodiments, the input device 203 may include amicrophone. In an embodiment, the input device 203 may include aplurality of microphones arranged to detect the direction of sound. Thesound output devices 206 and 207 may include a speaker. The sound outputdevices 206 and 207 may include a receiver 206 for a call and anexternal speaker 207. According to an embodiment, the external speaker207 may be disposed in the second housing and be configured to transmitsound to the outside through a first speaker hole 207 a. According to anembodiment, the external speaker 207 may be disposed in the inner space(e.g., the second space 2201 of FIG. 5A) of the second housing 220, andthus may provide sound of excellent quality to a user, regardless of asliding operation of the first housing 210. According to an embodiment,the connector port 208 may be disposed in the inner space (e.g., theinner space 2201 of FIG. 5A) of the second housing 220 together with theexternal speaker 207. In an embodiment, the connector port 208 may bedisposed in the inner space of the first housing 210, and in a slide-instate, may face the outside through a connector port hole (not shown)extending through the second housing 220. In this case, the connectorport 208 may be configured to be covered via the second housing 220 in aslide-in state. According to an embodiment, the receiver 206 may beconfigured to correspond to an external environment in the inner space(e.g., the first space of FIG. 5A) of the first housing 210. In thiscase, the first housing may include a sound release hole (e.g., a soundrelease hole 206 a of FIG. 17 ). According to an embodiment, the soundrelease hole (e.g., the sound release hole 206 a of FIG. 17 ) may becovered to maintain sound release performance and to prevent and/orreduce the sound release hole from being viewed from the outside via atleast a portion of the second housing 220. In an embodiment, the soundoutput devices 206 and 207 may include a speaker (e.g., a piezo speaker)which is operated while a separate speaker hole is excluded.

According to various embodiments, the sensor modules 204 and 217 mayproduce an internal operation state of the electronic device 200 or anelectric signal or a data value corresponding to an externalenvironmental state. The sensor modules 204 and 217 may include a firstsensor module 204 (e.g., a proximity sensor or an illuminance sensor)disposed on the front surface 200 a of the electronic device 200 and asecond sensor module 217 disposed on the rear surface 200 b of theelectronic device 200. According to an embodiment, the first sensormodule 204 may be disposed under the flexible display 230 at the side ofthe front surface 200 a of the electronic device 200. According to anembodiment, the first sensor module 204 and/or the second sensor module217 may include at least one of a proximity sensor, an illuminancesensor, a time of flight (TOF) sensor, an ultrasonic sensor, afingerprint recognition sensor, a gesture sensor, a gyro sensor, abarometric pressure sensor, a magnetic sensor, an acceleration sensor, agrip sensor, a color sensor, an infrared (IR) sensor, a biometricsensor, a temperature sensor, and a humidity sensor.

According to various embodiments, the camera modules 205 and 216 mayinclude a first camera module 205 disposed on the front surface 200 a ofthe electronic device 200 and a second camera module 216 disposed on therear surface 200 b of the electronic device 200. According to anembodiment, the electronic device 200 may include a flash 218 locatedadjacent to the second camera module 216. According to an embodiment,the camera modules 205 and 216 may include one or more lenses, imagesensors, and/or image signal processors. According to an embodiment, thefirst camera module 205 may be disposed under the flexible display 230and be configured to photograph an object through a portion of an activearea of the flexible display 230. According to an embodiment, the flash218 may include, for example, a light emitting diode or a xenon lamp.

According to various embodiments, the first camera module 205 of thecamera modules 205 and 216 and a sensor module 204 among the sensormodules 204 and 217 may be arranged to come in contact with an externalenvironment through an opening or a transmitting area perforated throughthe flexible display 230, in the inner space (e.g., the first space 2101of FIG. 5A) of the electronic device 200. According to an embodiment, anarea facing the first camera module 205 of the flexible display 230 maybe configured to be a transmitting area having a predeterminedtransmittance as a portion of an area of displaying contents. Accordingto an embodiment, the transmitting area may be configured to have atransmittance in the range of about 5% to about 20%. Such a transmittingarea may include an area which overlaps an effective area (e.g., anangle-of-view area) of the first camera module 205 and through whichlight for forming an image by means of an image sensor passes. Forexample, the transmitting area of the flexible display 230 may includean area in which the density of pixels and/or the density of wiring islower than that of the surrounding area. For example, the transmittingarea may replace the opening described above. For example, a cameramodule 205 may include an under display camera (UDC). In an embodiment,the sensor module 204 may be disposed in the inner space of theelectronic device 200 to perform a function without being visuallyexposed through the flexible display 230. According to an embodiment,the second camera module 216 of the camera modules 205 and 216 and/orthe sensor module 217 among the sensor modules 204 and 217 may bearranged in the inner space (e.g., the first space 2101 of FIG. 5A) ofthe electronic device 200 to correspond to an external environmentthrough at least a portion (e.g., a first rear surface cover 213) of thefirst housing. The second camera module and/or the sensor module 217 maybe arranged at predetermined positions of the first housing 210 to bevisible from the outside regardless of a slide-in state and/or aslide-out state.

FIG. 4 is an exploded perspective view of an electronic device accordingto various embodiments.

Referring to FIG. 4 , an electronic device 200 may include a firsthousing 210 including a first space (e.g., the first space 2101 of FIG.5A), a second housing 220 slidably coupled to the first housing 210 andincluding a second space (e.g., the second space 2201 of FIG. 5A), abendable member 240 disposed to be at least partially rotatable in thesecond space (e.g., the second space 2201 of FIG. 5A), a flexibledisplay 230 disposed to be supported by the first housing 210 and atleast a portion of the bendable member 240, and at least one slide hingemodule 260 configured to press the first housing 210 from the secondhousing 220 in a direction to slide the first housing in or out.According to an embodiment, the first space (e.g., the first space 2101of FIG. 5A) of the first housing 210 may be provided by coupling a firstbracket housing 210 a (e.g., a front bracket housing) and a secondbracket housing 210 b (e.g., a rear bracket housing). In an embodiment,at least a portion of the first bracket housing 210 a and/or the secondbracket housing 210 b may include at least a portion of the first sidesurface member 211 or the first support member (e.g., the first supportmember 212 of FIG. 3B), or may be replaced by the first support member212. According to an embodiment, the electronic device 200 may include amain board 250 disposed in a first space (e.g., the first space 2101 ofFIG. 5A). According to an embodiment, the electronic device 200 mayinclude a camera module (e.g., the camera module 216 of FIG. 3B)disposed in the first space (e.g., the first space 2101 of FIG. 5A) or asensor module (e.g., the sensor module 217 of FIG. 3B). According to anembodiment, the bendable member 240 may be disposed to have one endfixed to the first housing 210 and the other end to be received in thesecond space (e.g., the second space 2201 of FIG. 5A) of the secondhousing 220 to be at least partially rotatable. According to anembodiment, the bendable member 240 may include a plurality ofmulti-bars rotatably connected to each other. According to anembodiment, the bendable member 240 may be supported by a shaft-shapedsupport member 241 disposed in the second space (e.g., the second space2201 of FIG. 5A). According to an embodiment, the support member 241 mayinclude a support roller rotatably disposed in the second space (e.g.,the second space 2201 of FIG. 5A). In an embodiment, the electronicdevice 200 may include a tension providing member disposed in the innerspace (e.g., the second space 2201 of FIG. 5A) of the electronic device200 and configured to provide tension to prevent and/or reduce saggingof the flexible display 230 during movement by supporting the rearsurface of the bendable member 240. According to an embodiment, thetension providing member may include a tension belt of a metal material.

According to various embodiments, the bendable member 240 may be atleast partially accommodated in the second space (e.g., the second space2201 of FIG. 5A) in a slide-in state, and may be at least partially slidout from the second space (e.g., the second space 2201 of FIG. 5A) so asto form substantially the same plane as the first housing 210 in aslide-out state. Therefore, the flexible display 230 supported by thefirst housing 210 and the bendable member 240 may have a variabledisplay area according to a sliding operation. According to anembodiment, the electronic device 200 may further include a guide rail242 disposed on a side surface of the coupled first bracket housing 210a and second bracket housing 210 b and configured to be guided in theinner space (e.g., the second space 2201 of FIG. 5 ) of the secondhousing 220. In an embodiment, the electronic device 200 may include atleast one cover member 2241 and 2242 arranged at opposite side surfacesof the second support member (e.g., the second support member 222 ofFIG. 3B) of the second housing 220. According to an embodiment, the atleast one cover member 2241 and 2242 may include a first cover member2241 disposed to at least partially cover the fourth side surface (e.g.,the fourth side surface 2211 of FIG. 2A) of the second housing 220 and asecond cover member 2242 disposed to at least partially cover the sixthside surface (e.g., the sixth side surface 2213 of FIG. 2A) of thesecond housing 220.

FIG. 5A is a cross-sectional view of the electronic device taken alongline 5 a-5 a of FIG. 2B according to various embodiments. FIG. 5B is across-sectional view of the electronic device taken along line 5 b-5 bof FIG. 3B according to various embodiments.

Referring to FIGS. 5A 5B, an electronic device 200 may include a firsthousing 210 including a first space 2101, a second housing 220 includinga second space 2201, a bendable member 240 connected to the firsthousing 210 and at least partially received in the second space 2201 ina slide-in state, a flexible display 230 disposed to be supported by atleast a portion of the bendable member 240 and at least a portion of thefirst housing 210, and a slide hinge module 260 disposed in a thirdspace 2202 between the first housing 210 and the second housing 220 andconfigured to press the first housing from the second housing 220 in adirection (direction {circle around (1)})) to slide the first housingout or in. According to an embodiment, the electronic device 200 mayinclude a plurality of electronic components. According to anembodiment, the plurality of electronic components may be arranged inthe first space 2101 of the first housing 210. According to anembodiment, the first space 2101 may include a first sub-space A and asecond sub-space B connected to the first sub-space A. According to anembodiment, the second sub-space B may include a space corresponding toan area in which a portion of the first housing 210 and a portion of thesecond housing 220 overlap each other, in the rear surface (e.g., therear surface 200 b of FIG. 3B) of the electronic device 200, when theelectronic device 200 is in a slide-in state.

According to various embodiments, first electronic components of theplurality of electronic components, the operation of which requires acomparatively large mounting space, a relatively large mountingthickness T1 of the electronic device 200, or avoiding the overlappingstructure of the two housings 210 and 220, may be arranged in the firstsub-space A. According to an embodiment, the first electronic componentsmay include a camera module 216, a sensor module (e.g., the sensormodule 217 of FIG. 3B), or a flash (e.g., the flash 218 of FIG. 3B). Atleast a portion of the first electronic components may be arranged toface an external environment via the first support member 212 and/or thefirst rear surface cover 213. According to an embodiment, secondelectronic components of the plurality of electronic components, whichrequire a comparatively small mounting space or a relatively smallmounting thickness T2 of the electronic device 200 or are operableregardless of the overlapping structure of the two housings 210 and 220,may be arranged in the second sub-space B. According to an embodiment,the second electronic components may include a main board 250 and/or abattery 251. In an embodiment, a portion of electronic components (e.g.,a main board 250 or an FPCB) of the plurality of electronic componentsmay be arranged in the two sub-spaces together, in a case where thefirst sub-space A and the second sub-space B are connected to eachother. In an embodiment, the first sub-space A and/or the secondsub-space B described above may be designed to provide an efficientarrangement space for the plurality of electronic components, regardlessof a slide-in state and/or a slide-out state of the electronic device200.

According to various embodiments, at least one slide hinge module 260may be disposed in the third space 2202 between the first support member212 of the first housing 210 and the second support member 222 of thesecond housing 220, at the side of the rear surface (e.g., the rearsurface 200 b of FIG. 3B) of the electronic device 200. According to anembodiment, the third space 2202 may be configured to a structure ofbeing partially separated from the second space 2201 by at least aportion of the first housing 210 in a slide-in state and being at leastpartially connected to the second space 2201 in a slide-out state.According to an embodiment, the at least one slide hinge module 260 mayinclude an elastic member (e.g., a torsion spring) configured to providean elastic force of pressing the first housing 210 in a direction(direction {circle around (1)}) of being slid out from the secondhousing 220 and/or in a direction (direction {circle around (2)}) ofbeing slid in the second housing 220 with reference to a predeterminedinflection point. For example, by an operation of a user, the electronicdevice 200 may be pressed in a direction (direction {circle around (1)})in which the flexible display 230 is to be slid out, and at the time ofhaving moved beyond an inflection point, may be continuously pressed soas to maintain a slide-out state via the slide hinge module 260.According to an embodiment, by an operation of a user, the electronicdevice 200 may be pressed in a direction (direction {circle around (2)})in which the flexible display 230 is to be slid in, and at the time ofhaving moved beyond an inflection point, may be continuously pressed soas to maintain a slide-in state via the slide hinge module 260.

In the electronic device 200 according to embodiments of the disclosure,electronic components may be appropriately arranged in the first space2101 of the first housing 210 to correspond to the sub-spaces A and Bhaving shapes different from each other, and thus an efficientarrangement structure may help to slim the electronic device 200 andimprove performance, and the first housing 210 may be pressed in adirection (direction {circle around (1)}) of being slid out from thesecond housing 220 and/or in a direction (direction {circle around (2)})of being slid in the second housing 220 via the slide hinge module 260with reference to a predetermined inflection point, and thus improvedoperational convenience may be provided.

FIG. 6 is a partial exploded perspective view of an electronic deviceincluding a slide hinge module according to various embodiments.

Referring to FIG. 6 , an electronic device 200 may include a firsthousing 210, a second housing 220 slidably coupled to the first housing210, and at least one slide hinge module 260 disposed between the firsthousing 210 and the second housing 220 and configured to press the firsthousing 210 from the second housing 220 in a direction to slide thefirst housing in or out. According to an embodiment, the at least oneslide hinge module 260 may be disposed between the first support member212 of the first housing 210 and the second support member 222 of thesecond housing 220. According to an embodiment, the at least one slidehinge module 260 may be arranged at four places to be spaced apredetermined space apart between the first support member 212 and thesecond support member 222, but is not limited to this. For example, theat least one slide hinge module 260 may be arranged at less than fourplaces or at four or more places according to the magnitude of apressing force by which the first housing 210 is slid in or slid out.

According to various embodiments, each of the at least one slide hingemodule 260 may include a torsion spring 261. According to an embodiment,the torsion spring 261 may be installed to be capable of pressing thefirst housing 210 from the second housing 220 in a direction to slidethe first housing in or out with reference to a predetermined inflectionpoint. According to an embodiment, the at least one slide hinge module260 may be slidably coupled to the first support member 212 and mayinclude a slide plate 262 fixed to the second support member 222.Therefore, the slide plate 262 may slidably move on the first supportmember 212 according to a slide-in operation and a slide-out operationof the electronic device. According to an embodiment, a sliding distance(e.g., a sliding distance S of FIG. 7B) of the first housing 210 may bedetermined according to the shape of the slide plate 262 and thecoupling position of the at least one slide hinge module 260. Accordingto an embodiment, a portion (e.g., the other end 2612 of FIG. 7B) of thetorsion spring 261 may be fixed to the slide plate 262. In anembodiment, the at least one slide hinge module 260 may be configured ina manner in which at least one torsion spring 261 is coupled to oneslide plate 262. As illustrated, the at least one slide hinge module 260has two torsion springs 261 coupled to one slide plate 262, but onetorsion spring 261 or three or more torsion springs 261 may be coupledto one slide plate 262.

FIG. 7A is a diagram illustrating an electronic device having a slidehinge module disposed therein in a slide-in state according to variousembodiments. FIG. 7B is a diagram illustrating an enlarged view of area7 b of FIG. 7A according to various embodiments. FIG. 7B is a viewillustrating a state in which the slide hinge module is disposed in thefirst housing, in a state where the second housing is omitted.

Referring to FIGS. 7A and 7B, an electronic device 200 may include afirst housing 210, a second housing 220 slidably coupled to the firsthousing 210, and at least one slide hinge module 260 disposed betweenthe first housing 210 and the second housing 220 and configured to pressthe first housing 210 from the second housing 220 in a direction toslide the first housing in or out. According to an embodiment, theelectronic device 200 may include a slide plate 262 slidably disposed onthe first support member 212 of the first housing 210. According to anembodiment, the slide plate 262 may be fixed to the second support 212of the second housing 220 via a fastening member such as a screw.

According to various embodiments, the at least one slide hinge module260 may include a torsion spring 261 disposed between the first supportmember 212 of the first housing 210 and the second support member 222 ofthe second housing 220. According to an embodiment, one end 2611 of thetorsion spring 261 may be flexibly coupled to the first support member212 and the other end 2612 thereof may be flexibly coupled to the slideplate 262. According to an embodiment, the torsion spring 261 may haveelasticity between the first support member 212 and the second supportmember 222 and be at least partially flexible, while the electronicdevice 200 is sliding to be switched from a slide-in state to aslide-out state or switched from a slide-out state to a slide-in state.According to an embodiment, when the slide plate 262 is moved in adirection (direction {circle around (1)}) to be slid out with referenceto a predetermined inflection point, the torsion spring 261 may bedisposed to provide a pressing force of continuously pressing the firsthousing 210 in a direction (direction {circle around (1)}) to be slidout. According to an embodiment, when the slide plate 262 is moved in adirection (direction {circle around (2)}) to be slid in with referenceto a predetermined inflection point, the torsion spring 261 may bedisposed to provide a pressing force of continuously pressing the firsthousing 210 in a direction (direction {circle around (2)}) to be slidin.

According to various embodiment, an inflection point may be configuredat a position of half S/2 of the total sliding distance S of the slideplate 262. According to an embodiment, when the flexible display 230 isswitched from a slide-in state to a slide-out state, the slidingdistance S may be substantially the same as the second width W2 of asecond portion (e.g., the second portion 230 b of FIG. 3A) which isvisible from the outside. In an embodiment, an inflection point may beconfigured to a position biased to a direction in which the firsthousing 210 is slid in or slid out, a position S/2 of half of the totalsliding distance S of the slide plate 262. In an embodiment, one end2611 of the torsion spring 261 may be flexibly coupled to the firstsupport member 212 of the first housing 210 and the other end 2612thereof may be flexibly coupled to the second support member 222 of thesecond housing 220, while the slide plate 262 is omitted.

According to various embodiments, the sliding distance S may bedetermined according to the shape of the slide plate 262 slidablycoupled to the first support member 212. According to an embodiment, thesliding distance S may be determined according to the width W4 of theslide plate 262. For example, as the width W4 of the slide plate 262 maybecome greater, so the sliding distance S may become smaller, and as thewidth W4 of the slide plate 262 may become smaller, so the slidingdistance S may become greater. In an embodiment, the sliding distance Smay be determined according to the coupling positions at which one end2611 of the torsion spring 261 and the other end 2612 thereof arecoupled to the first support member 212 and the second support member222, respectively.

According to various embodiments, one end 2611 of the torsion spring 261may rotate clockwise or counterclockwise with reference to the pointfixed to the first support member 212. For another example, the otherend 2612 of the torsion spring 261 may rotate clockwise orcounterclockwise with reference to the point fixed to the second supportmember 222 or the slide plate 262.

FIG. 8 is a diagram illustrating an electronic device having a slidehinge module disposed therein in a slide-out state according to variousembodiments.

Referring to FIG. 8 , an electronic device 200 may include a firsthousing 210, a second housing 220 slidably coupled to the first housing210, and at least one slide hinge module 260 disposed between the firsthousing 210 and the second housing 220 and configured to press the firsthousing 210 from the second housing 220 in a direction to slide thefirst housing in or out. According to an embodiment, the slide hingemodule 260 may be disposed at an overlapping portion 212 b of the firsthousing 210, and thus, in a slide-in state, may be at least partiallycovered to prevent and/or reduce the slide hinge module 260 from beingviewed from the outside via the second support member 222 of the secondhousing 220. According to an embodiment, in a slide-out state of theelectronic device 200, the slide hinge module 260 may reduce theaesthetics of the electronic device 200 because a portion disposed onthe first support member, which is, for example, at least a portion(e.g., one end 2611) of the torsion spring 261, is exposed to be visiblefrom the outside. Therefore, the electronic device 200 may include acover member 214 at least partially disposed on the first support member212 of the first housing 210 and configured to be capable of covering aportion of the slide hinge module 260 in a slide-out state. According toan embodiment, the cover member 214 may be disposed in a manner whereinterference for a sliding operation of the first housing 210 and thesecond housing 220 is avoided. In an embodiment, the cover member 214may also include a conduit structure disposed between the first housing210 and the second housing 220, slidable in or out, and having an innerspace, changeable in association with the sliding operation of the firsthousing 210. Therefore, one end of the conduit structure may be fixed tothe first housing 210 and the other end thereof may be fixed to thesecond housing 220. According to an embodiment, the conduit structuremay include a plurality of conduits arranged to be slidable into or outof each other and including inner spaces. For example, in a slide-outstate, at least a portion of the slide hinge module 260 exposable to theoutside of the electronic device may be accommodated in the inner spaceof the conduit structure, and thus may be covered to prevent and/orreduce the at least a portion from being viewed from the outside.

FIG. 9A and FIG. 9B are diagrams illustrating a slide-in state and aslide-out state of an electronic device including an antenna,respectively, according to various embodiments.

Referring to FIG. 9A and FIG. 9B, an electronic device 200 may include afirst housing 210 and a second housing 220 slidably coupled to the firsthousing 210 by a predetermined reciprocating distance. According to anembodiment, the first housing 210 may include a first side surfacemember 211 including a first side surface 2111, a second side surface2112, and a third side surface 2113 and a first support member 212extending from the first side surface member 211 to a first space 2101.According to an embodiment, the first side surface member 211 and/or thefirst support member 212 may at least partially include a conductivematerial 310 a (e.g., metal) and/or a non-conductive material 310 b(e.g., polymer). For example, the non-conductive material 310 b may beinsert-injected with the conductive material 310 a. According to anembodiment, the second housing 220 may include a second side surfacemember 221 including a fourth side surface 2211, a fifth side surface2212, and a sixth side surface 2213 and a second support member 222extending from the second side surface member 221 to the second space2201. According to an embodiment, the second side surface member 221and/or the second support member 222 may at least partially include theconductive material 310 a (e.g., metal) and/or the non-conductivematerial 310 b (e.g., polymer).

According to various embodiments, the electronic device 200 may includean antenna R disposed through at least partial area C of the firsthousing 210, visible from the outside in a slide-in state. According toan embodiment, when the first support member 212 is viewed from above,the antenna R may be disposed at a position overlapping an areaconfigured of the non-conductive material 310 b, in the first sub-space(e.g., the first sub-space A of FIG. 3B) corresponding to thenon-overlapping portion 212 a. According to an embodiment, the antenna Rmay include at least one conductive pattern (e.g., an antenna pattern)arranged via the main board 250 or an antenna carrier. According to anembodiment, the antenna R may be electrically connected to a wirelesscommunication circuit (e.g., a wireless communication module 192 of FIG.1 ) disposed on the main board 250 of the first space 2101. According toan embodiment, the wireless communication circuit (e.g., the wirelesscommunication module 192 of FIG. 1 ) may be configured to transmitand/or receive a wireless signal via a first conductive part 311 in atleast one frequency band among a low band (about 700 MHz to 900 MHz), amid band (about 1700 MHz to 2100 MHz), a high band (about 2300 MHz to2700 MHz), a sub-6 band (about 3 GHz to 6 GHz), or an NR band (about 3GHz to 300 GHz). However, an operation frequency band may not be limitedto the above example. Therefore, regardless of a slide-in state and aslide-out state, the antenna R may be disposed at a positioncorresponding to the non-overlapping portion 212 a of the first supportmember 212 disposed to be visible from the outside, and thus theinterference of the second housing 220 according to a slide-in/slide-outoperation may be avoided and radiation performance deteriorationresulting therefrom may be reduced.

According to various embodiments, in a slide-in state, the electronicdevice 200 may include at least one first conductive part disposed viaat least a portion of the first side surface member 211 exposed (e.g.,visible) to the outside without the interference of the second housing220 and electrically connected to the wireless communication circuit(e.g., the wireless communication module 192 of FIG. 1 ). According toan embodiment, in a slide-in state, at least one first conductive partmay be configured by at least one among at least a portion of the firstsupport member 212, at least a portion of the first side surface 2111,at least a portion of the second side surface 2112, or at least aportion of the third side surface 2113, visible from the outside.According to an embodiment, the at least one first conductive part mayinclude a first conductive portion 311 segmented via a firstnon-conductive portion 321 disposed on the first side surface 2111 and asecond non-conductive portion 322 disposed on the second side surface2112, a second conductive portion 312 segmented via the secondnon-conductive portion 322 and a third non-conductive portion 323disposed on the second side surface 2112, a third conductive portion 313segmented via the third non-conductive portion 323 and a fourthnon-conductive portion 324 disposed on the second side surface 2112, anda fourth conductive portion 314 configured by the fourth non-conductiveportion 324 and a fifth non-conductive portion 325 disposed on the thirdside surface 2113. According to an embodiment, the first, second, third,and fourth conductive portions 311, 312, 313, and 314 may beelectrically connected to the wireless communication circuit (e.g., awireless communication module 192 of FIG. 1 ) disposed in the firstspace 2101 of the first housing 210, and thus may operate as antennasconfigured to transmit and/or receive a wireless signal in apredetermined frequency band. According to an embodiment, the wirelesscommunication circuit (e.g., the wireless communication module 192 ofFIG. 1 ) may be configured to transmit and/or receive a wireless signalvia the first, second, third, and fourth conductive portions 311, 312,313, and 314 in at least one frequency band among a low band (e.g.,about 700 MHz to 900 MHz), a mid band (about 1700 MHz to 2100 MHz), ahigh band (about 2300 MHz to 2700 MHz), or a sub-6 band (about 3 GHz to6 GHz). However, the operation frequency band may not be limited to theabove example.

According to various embodiments, the electronic device 200 may includeat least one second conductive part disposed on at least a portion ofthe second housing 220 and used as an antenna so as to exhibit excellentradiation performance regardless of a slide-in state and a slide-outstate. According to an embodiment, the at least one second conductivepart may include a fifth conductive portion 331 segmented via a sixthnon-conductive portion 341 and a seventh non-conductive portion 342arranged to be spaced a predetermined interval apart from each other onthe fourth side surface 2211, a sixth conductive portion 332 segmentedvia the seventh non-conductive portion 342 and a eighth non-conductiveportion 343 of the sixth side surface 2213, and a seventh conductiveportion 333 segmented via the eighth non-conductive portion 343 and aninth non-conductive portion 344 disposed on the sixth side surface2213. According to an embodiment, the fifth, sixth, and seventhconductive portions 331, 332, and 333 may be electrically connected tothe main board 250 disposed in the first housing 210 via a flexible FPCB(e.g., an FPCB 2071 in FIG. 12D) having a length and flexibility enoughto correspond to a sliding operation. For example, the FPCB may beelectrically connected to the wireless communication circuit disposed onthe main board 250. According to an embodiment, the wirelesscommunication circuit (e.g., the wireless communication module 192 ofFIG. 1 ) may be configured to transmit and/or receive a wireless signalvia the fifth, sixth and seventh conductive portions 331, 332, and 333in at least one frequency band among a low band (e.g., about 700 MHz to900 MHz), a mid band (about 1700 MHz to 2100 MHz), a high band (about2300 MHz to 2700 MHz), or a sub-6 band (about 3 GHz to 6 GHz). However,an operation frequency band may not be limited to the above examples.

According to various embodiments, in a slide-in state, the first sidesurface 2111 may face the fourth side surface 2211 and be accommodatedin the second space 2201 of the second housing 220, to prevent and/orreduce the first side surface 2111 from being viewed from the outside.The radiation performance of the first conductive portion 311 and/or thefifth conductive portion 331 may be deteriorated by parasitic resonancefrequencies of the overlapping counterpart conductive portions.Therefore, in a slide-in state, the first non-conductive portion 321 maybe disposed to correspond to (be aligned with) the sixth non-conductiveportion 341, and thus may reduce radiation performance deterioration. Inan embodiment, in a slide-in state, the first side surface 2111 may bepartially accommodated in the second space 2201 of the second housing220, and thus may be disposed to allow at least a portion thereof to bevisible from the outside. In an embodiment, in a slide-in state, thethird side surface 2113 may face the sixth side surface 2213 and beaccommodated in the second space 2201 of the second housing 220 so as toprevent and/or reduce the third side surface 2113 from being viewed fromthe outside. The radiation performance of the fourth conductive portion314 and/or the seventh conductive portion 333 may be deteriorated byparasitic resonance frequencies of the overlapping counterpartconductive portions. Therefore, in a slide-in state, the fifthnon-conductive portion 325 may be disposed to correspond to (be alignedwith) the ninth non-conductive portion 344, and thus may reduceradiation performance deterioration.

According to embodiments of the disclosure, at least one antenna R 311,312, 313, 314, 331, 332, and 333 included in the electronic device 200may exhibit predetermined radiation performance regardless of a slidingoperation in a slide-in state and/or a slide-out state, by beingarranged at a position where the first housing 210 and the secondhousing 220 do not overlap each other.

FIG. 10A is a partial perspective view illustrating an innerconfiguration of a first housing in area 10 a of FIG. 9B according tovarious embodiments. FIG. 10B is an enlarged perspective viewillustrating area 10 b of FIG. 9B according to various embodiments. FIG.10C is a partial cross-sectional view of the first housing taken alongline 10 c-10 c of FIG. 10B according to various embodiments.

Referring to FIGS. 10A, 10B and 10C, the fourth conductive portion 314may be segmented via the fourth non-conductive portion 324 and the fifthnon-conductive portion 325 spaced a predetermined interval apart fromeach other in the second bracket housing 210 b. For example, the fourthconductive portion 314 may be segmented via the fourth non-conductiveportion 324 and the fifth non-conductive portion 325 configured of thenon-conductive material 310 b at least partially extending to a portionof the first support member 212.

According to various embodiments, the first housing 210 may include thefirst bracket housing 210 a and the second bracket housing 210 bconfigured to be couplable to each other through the conductive material310 a and the non-conductive material 310 b insert-injected with theconductive material 310 a. In an embodiment, the first bracket housing210 a and the second bracket housing 210 b may be coupled to each othervia a coupling structure provided via the non-conductive member 310 b.In an embodiment, the first bracket housing 210 a and the second brackethousing 210 b may also be coupled to each other via a coupling structureprovided via the conductive material 310 a. In an embodiment, the firstbracket housing 210 a and the second bracket housing 210 b may also becoupled to each other via a coupling structure provided via theconductive material 310 a and the non-conductive material 310 b.According to an embodiment, at least a portion of the first brackethousing 210 a may be configured to support the flexible display 230through the conductive material 310 a and/or the non-conductive material310 b. According to an embodiment, at least a portion of the secondbracket housing 210 b may be configured to support the first rearsurface cover 213 through the conductive material 310 a and/or thenon-conductive material 310 b. According to an embodiment, thenon-conductive material 310 b configuring the second bracket housing 210a is advantageous for shape change, and thus may include at least oneopening 3701 configured to allow an external electronic component (e.g.,a socket tray) to be accommodated therethrough. According to anembodiment, the at least one opening 3701 may extend to be connected tothe non-conductive portion 325. In an embodiment, the conductivematerial 310 a and/or the non-conductive material 310 b may configurethe exterior (a portion of a side surface and/or a rear surface of anelectronic device) of the electronic device 200 so as to be visible fromthe outside.

FIG. 11A is a partial perspective view of a second housing according tovarious embodiments. FIG. 11B is a partial cross-sectional view of thesecond housing taken along line 11 b-11 b of FIG. 11A according tovarious embodiments. FIG. 11A is a view illustrating a portion of thesecond housing 220 in which the first side surface cover 2241 isomitted.

Referring to FIGS. 11A and 11B, the second housing 220 may include thefifth conductive portion 331 and the sixth conductive portion 332segmented via the sixth non-conductive portion 341 and the seventhnon-conductive portion 342 spaced a predetermined interval apart fromeach other, in the fourth side surface 2211. According to an embodiment,the fifth conductive portion 331 and the sixth conductive portion 332configured of the conductive material 310 a and the sixth non-conductiveportion 341 and the seventh non-conductive portion 342 configured of thenon-conductive material 310 b may also be configured to extend to atleast a portion of the second support member 222 of the second housing220.

According to various embodiments, the fifth conductive portion 331, thesixth conductive portion 332, the sixth non-conductive portion 341, andthe seventh non-conductive portion 342 may be arranged in the fourthside surface 2211 to be visible from the outside. According to anembodiment, in the second housing, at least a portion of the fifthconductive portion 331, the sixth conductive portion 332, the sixthnon-conductive portion 341, and the seventh non-conductive portion 342may be covered to prevent and/or reduce the at least a portion frombeing viewed from the outside by the first side surface cover 2241disposed on the fourth side surface 2211.

According to various embodiments, the second side surface member 221 andthe second support member 222 configured of the conductive material 310a and the non-conductive material 310 b may be configured in a shapecorresponding to a coupling structure of the guide rail 242 coupled tothe second housing 220 and the first housing 210 configured by thecoupling of the first bracket housing 210 a and the second brackethousing 210 b. According to an embodiment, at least a portion of acorresponding portion of the first housing 210 coupled to the guide rail242 and/or the first housing 210 may be configured to allow theconductive material 310 a to be disposed therein to reinforce rigidity.

FIG. 12A is a diagram illustrating an electrical connection structure ofan antenna in area 12 a of FIG. 9B according to various embodiments.FIG. 12B is a diagram illustrating an electrical connection structure ofan antenna in area 12 b of FIG. 9B according to various embodiments.FIG. 12C is a diagram illustrating an electrical connection structure ofan antenna in area 12 c of FIG. 9B according to various embodiments.

Referring to FIG. 12A and FIG. 12C, the first housing 210 may includethe first side surface member 211 and the first support member 212 atleast partially extending from the first side surface member 211 to thefirst space 2101. According to an embodiment, the first housing 210and/or the second housing 220 may include a conductive material and anon-conductive material coupled to the conductive material, and theconductive material may include at least one conductive portionsegmented via the non-conductive material. According to an embodiment,at least a portion of the at least one conductive portion may beelectrically connected to a wireless communication circuit, and thus maybe used as an antenna. For example, the first housing 210 may includethe conductive portions 311, 312, 313, 314, and 315 configured of theconductive material 310 a and segmented via the plurality ofnon-conductive portions 321, 322, 323, 324, and 325 spaced apredetermined interval apart from each other and configured of thenon-conductive material 310 b. According to an embodiment, theconductive portions 311, 312, 313, 314, and 315 may be electricallyconnected to the main board 250 disposed in the first space 2101 of thefirst housing 210. For example, the conductive portions 311, 312, 313,314, or 315 may be electrically connected to the main board 250 via anelectrical connection member CS. In an embodiment, the conductiveportions 311, 312, 313, 314, and 315 may include portions (e.g.,connection pieces extending to the first space 2101) easy to beconnected to the electrical connection member CS. According to anembodiment, the electrical connection member CS may include a C-clip, aconductive contact switch, or a pogo pin. Therefore, the conductiveportions 311, 312, 313, 314, and 315 may be electrically connected tothe wireless communication circuit (e.g., the wireless communicationmodule 192 of FIG. 1 ) of the main board 250, and thus may be used asantennas configured to operate in at least one predetermined frequencyband. In an embodiment, the wireless communication circuit (e.g., thewireless communication module 192 of FIG. 1 ) may be disposed at aposition different from the main board in the first space 210, or may bedisposed on a sub-board (e.g., a sub-board 252 of FIG. 15A) spaced apartfrom and electrically connected to the main board 250.

FIG. 12D is a partial perspective view illustrating an electricalconnection structure of an antenna in area 12 d of FIG. 9B according tovarious embodiments.

Referring to FIG. 12D, the second housing 220 may include the sixthconductive portion 332 segmented via the seventh non-conductive portion342. According to an embodiment, the sixth conductive portion 332 may beelectrically connected to the wireless communication circuit (e.g., thewireless communication module 192 of FIG. 1 ) via a bendable FPCB 2071extending from the second space 2201 to the first space 2101 of thefirst housing 210. According to an embodiment, the bendable FPCB 2071may be disposed to have a length and flexibility enough to accommodatethe sliding operation of the electronic device 200. Although notillustrated, but the fifth conductive portion (e.g., the fifthconductive portion 331 of FIG. 9B) and/or the seventh conductive portion(e.g., the seventh conductive portion 333 of FIG. 9B) arranged in thesecond housing 220 may also be electrically connected to the wirelesscommunication circuit (e.g., the wireless communication module 192 ofFIG. 1 ) disposed in the first space 2101 in a substantially similarmanner.

According to various embodiments, the second housing 210 may include thespeaker 207 (e.g., an external speaker or a speaker module) disposed toallow sound to be output to the outside through the first speaker hole207 a disposed on the fourth side surface 2211 in the second space 2201.According to an embodiment, the speaker 207 may move together with thesecond housing 220, and may extend to the first housing 210 via thebendable FPCB 2071. The sixth conductive portion 332 used as an antennamay be electrically connected to the wireless communication circuit(e.g., the wireless communication module 192 of FIG. 1 ) via thebendable FPCB 2071 extending from the speaker 207 to the first space2101. In an embodiment, the FPCB 2071 connecting the speaker 207 and anFPCB connecting the sixth conductive portion 332 may be separatelyarranged. According to an embodiment, as an electrical connection memberCS, the sixth conductive portion 332 may be electrically connected tothe bendable FPCB 2071 via a screw which is fastened through the fourthside surface 2211 so that the speaker 207 is fixed in the second space2201.

FIGS. 13A 13B are diagrams illustrating a slide-in state and a slide-outstate of an electronic device including an antenna member, respectively,according to various embodiments. FIG. 14A is a cross-sectional view ofthe electronic device taken along line 14 a-14 a of FIG. 13A accordingto various embodiments. FIG. 14B is a cross-sectional view of theelectronic device taken along line 14 b-14 b of FIG. 13B according tovarious embodiments.

In explaining components of the electronic device 200 of FIG. 13A toFIG. 14B, the same reference numerals have been used for the componentssubstantially the same as the components of the electronic device 200 ofFIG. 5A and FIG. 5B, and the detailed descriptions may be omitted.

Referring to FIG. 13A to FIG. 14B, the electronic device 200 may includean antenna member 350 disposed to transmit and receive a wireless signalvia the second housing 220 of the rear surface (e.g., the rear surface200 b of FIG. 2B) side of the electronic device 200. According to anembodiment, the antenna member 350 may be disposed between the secondrear surface cover 223 and the second support member 222 of the secondhousing 220. The second rear surface cover 223 may be configured of adielectric material (e.g., polymer or glass) to allow the antenna member350 to guide radiation in a direction toward which the second rearsurface cover 223 is oriented. According to an embodiment, the antennamember 350 may be electrically connected to the main board 250 via abendable extension unit 351 extending from the antenna member 350 to thefirst space 2101 of the first housing 210. According to an embodiment,the bendable extension unit 351 may include a bendable FPCB extendingfrom the antenna member 350. According to an embodiment, one end of theextension unit may be electrically connected to the antenna member 350,and the other end thereof may be electrically connected to the mainboard via an electrical connection member such as a conductive spring3511. According to an embodiment, the extension unit 351 may be disposedon the rear surface of the second support member 222 or may be disposedto be at least partially supported via a support unit 3501 which isadditionally disposed. In an embodiment, the bendable extension unit 351may be disposed separately from the antenna member 350 and may beelectrically connected to the antenna member 350.

According to various embodiments, the electronic device 200 may includea through-hole 2204 extending through the first support member 212 ofthe first housing 210 so as to allow the bendable extension unit 351 topass through the first space 2101 from a space between the secondsupport member 222 and the second rear surface cover 223. According toan embodiment, the through-hole 2204 may be disposed at a positioncorresponding to the first support member 212 of the first housing 210in a slide-out state to prevent and/or reduce the through-hole 2204 frombeing viewed from the outside via the second support member 222, andthus may be disposed to prevent and/or reduce the bendable extensionunit 315 from being viewed from the outside even in a slide-out state.According to an embodiment, the antenna member 350 may include a coilmember disposed via a dielectric film. According to an embodiment, theantenna member 350 may include a multi-function coil or multi-functioncore (MFC) antenna configured to perform a wireless charging function, aneat field communication (NFC) function, and/or an electronic paymentfunction.

FIG. 15A is a perspective view illustrating a first housing showing acomponent arrangement structure according to various embodiments. FIG.15B is a partial perspective view of an electronic device illustrating aspeaker arrangement structure according to various embodiments.

Referring to FIG. 15A and FIG. 15B, an electronic device (e.g., anelectronic device 200 of FIG. 16B) may include a first housing 210including a first space (e.g., a first space 2101 of FIG. 16B) and asecond housing (e.g., a second housing 220 of FIG. 16B) slidably coupledto the first housing 210 and including a second space (e.g., a secondspace 2201 of FIG. 16B). According to an embodiment, the electronicdevice 200 may include at least one first electronic component arrangedin an inner space 2101 of the first housing 210. According to anembodiment, the at least one first electronic component may include amain board 250, at least one camera module 216, a sensor module 217, aflash 218, a receiver 206 (e.g., a speaker for a call) and/or a battery251, arranged in the first space 2101. For example, the at least onecamera module 216 may be arranged on the main board 250. For anotherexample, the battery 251 may be disposed at a position at which thebattery does not overlap the main board 250. According to an embodiment,the at least one first electronic component may be arranged to be spacedapart from the main board 250 and may include a sub-board 252electrically connected thereto via a connection cable 253. In anembodiment, the main board 250 may expand to the area where thesub-board 252 is disposed, while the connection cable 253 and thesub-board 252 are omitted.

According to various embodiments, the electronic device 200 may includeat least one second electronic component arranged in a second space 2201of the second housing 220. According to an embodiment, the at least onesecond electronic component may include a speaker 207 (e.g., an externalspeaker). According to an embodiment, the speaker 207 may be disposed inthe second space 2201 via a change of a structural shape of the secondsupport member 222 and/or the second side surface member 221. Accordingto an embodiment, the speaker 207 may be fixed in the second space 2201inserted through the second side surface member 221 via a fasteningmember such as a screw S1. According to an embodiment, the speaker 207may be disposed to be capable of outputting sound to the outside via thefirst speaker hole 207 a extending through the first side surface cover2241. According to an embodiment, in the second space 2201, the speaker207 may be disposed to face a second speaker output hole 207 b extendingthrough the fourth side surface 2211 of the second side surface member221, and the second speaker hole 207 b may be aligned to correspond tothe first speaker hole 207 a of the first side surface cover 2241.According to an embodiment, the electronic device 200 may include asealing member 2072 disposed between the fourth side surface 2211 andthe first side surface cover 2241. According to an embodiment, thesealing member 2072 may include at least one of a sponge, rubber,urethane, or silicone.

According to various embodiments, the electronic device 200 may includea bendable FPCB 2071 extending from the second space 2201 to the firstspace 2101 and configured to electrically connect the speaker 207 to thesub-board 252. According to an embodiment, the bendable FPCB 2071 may beconfigured to have a length and flexibility to accommodate a slidingoperation of the electronic device 200. According to an embodiment, thefirst housing 210 may include an accommodation unit 212 c configured toaccommodate the speaker 207 disposed in the second space 2201 of thesecond housing 220, via a structural shape of the first support member212 in a slide-in state.

The speaker 207 according to an embodiment of the disclosure may bedisposed in the second space 2201 of the second housing 220 and bedisposed to output sound through the first speaker hole 207 a and thesecond speaker hole 207 b which are exposed to the outside via thesecond side surface member 221 of the second housing 220 regardless of aslide-in/slide-out operation, and thus sound quality deterioration suchas sound leakage caused by gaps between the side surfaces (e.g., thefirst side surface 2111 and the fourth side surface 2211), producedaccording to the sliding operation or the assembly tolerance of the twohousings 210 and 220 may be prevented and/or reduced.

FIGS. 16A and 16B are diagrams illustrating a slide-in state and aslide-out state of an electronic device including a speaker,respectively, according to various embodiments. FIG. 17 is a partialcross-sectional view of the electronic device taken along line 17-17 ofFIG. 16A according to various embodiments.

FIG. 16A is a view illustrating an arrangement configuration ofelectronic components of the first housing, in a state where the secondsupport member of the second housing is omitted.

Referring to FIGS. 16A, 16B and 17 , in a slide-in state of theelectronic device 200, the speaker 207 disposed in the second space 2201of the second housing 220 may be located in the accommodation unit 212 cdisposed via a structural shape of the first support member 212 of thefirst housing 210. According to an embodiment, in a slide-out state ofthe electronic device 200, the first housing 210 may be moved from thesecond housing 220 in a predetermined first direction (direction {circlearound (1)}), and the speaker 207 disposed in the second space 2201 mayalso be moved from the accommodation unit 212 c. The speaker 207 maycontinuously maintain the state of the electrical connection with thesub-board 252 via the bendable FPCB 2071. According to an embodiment,the speaker 207 may output sound through the first speaker hole 207 aand the second speaker hole 207 b which are arranged through the secondhousing 220 to be exposed to the outside, and thus the best sound outputperformance may be maintained.

According to various embodiments, the electronic device 200 may includea receiver 206 (e.g., a speaker for a call) disposed in the first space2101, via a structural shape of the first support member 212 of thefirst housing 210. According to an embodiment, the receiver 206 may bedisposed to output sound to the outside through a through-hole 206 bextending through the first bracket housing 210 a of the first housing210 and a sound output hole 206 a configured via the coupling structureof the first bracket housing 210 a and the second bracket housing 210 b.According to an embodiment, in a slide-in state, the sound output hole206 a may be disposed to prevent and/or reduce the sound output hole 206a from being viewed from the outside via the second side surface cover2242. According to an embodiment, in a slide-in state, the sound outputhole 206 a may be covered to prevent and/or reduce the sound output hole206 a from being viewed from the outside via a bent unit 2242 aconfigured to be bent at an end of the second side surface cover 2242.In an embodiment, in a slide-out state, the sound output hole 206 a maybe disposed at a position at least partially visible from the outside.In an embodiment, even in a slide-out state, the sound output hole 206 amay be disposed to be covered via the second side surface cover 2242 toprevent and/or reduce the sound output hole 206 a from being viewed fromthe outside.

According to an embodiment of the disclosure, at least one otherelectronic component, which may be interfered with according to asliding operation of the first housing 210 and the second housing 220,may be disposed in substantially the same manner as the speaker 207.According to an embodiment, the at least one other electronic componentmay include at least one of an interface (IF) connector port, a sensormodule, or a socket module.

FIGS. 18A, 18B, 19A and 19B are diagrams illustrating a mountingstructure of a card tray in a slide-in state and a slide-out state of anelectronic device according to various embodiments.

Referring to FIGS. 18A, 18B, 19A and 19B, the electronic device 200 mayinclude a first housing 210 and a second housing 220 slidably coupled tothe first housing 210 by a predetermined reciprocating distance.According to an embodiment, the first housing 210 may include a firstside surface member 211 including a first side surface 2111, a secondside surface 2112, and a third side surface 2113 and a first supportmember 212 extending from the first side surface member 211 to the firstspace 2101. According to an embodiment, the second housing 220 mayinclude a second side surface member 222 including a fourth side surface2211, a fifth side surface 2212, and a sixth side surface 2213 and asecond support member 222 extending from the second side surface member222 to the second space 2201. According to an embodiment, in a slide-instate, at least a portion of the first side surface 2111 and the thirdside surface 2113 may be accommodated in the second space 2201 and facethe fourth side surface 2211 and the sixth side surface 2213 of thesecond housing 220, respectively, and thus may be arranged to preventand/or reduce the at least a portion from being viewed from the outside.According to an embodiment, in a slide-out state, the first side surface2111 and the third side surface 2113 may be at least partially slid outfrom the second space 2201, and thus may be arranged to be visible fromthe outside. According to an embodiment, the electronic device 200 mayinclude a component assembly (CA) (see, e.g., FIG. 20 ) disposed in thefirst sub-space A and disposed in a manner in which at least twoelectronic components are stacked. According to an embodiment, thecomponent assembly (CA) may include a first electronic componentdisposed in the first sub-space A and a second electronic componentdisposed in a stacked manner with the first electronic component anddisposed to correspond to an external environment via at least a portionof the third side surface 2113. According to an embodiment, the firstelectronic component may include, in the first sub-space A, a cameramodule 216 disposed to detect an external environment through the firstrear surface cover. In an embodiment, the first electronic component mayinclude at least one of a camera module 216, a sensor module 217, or aflash 218. According to an embodiment, the second electronic componentmay include, in the first sub-space A, a socket module (e.g., a socketmodule 370 of FIG. 20 ) disposed to be capable of accommodating a sockettray 400 through an opening 3701 extending through the third sidesurface 2113. According to an embodiment, when the first support member212 is viewed from above, at least two electronic components may bearranged in a stacked manner of at least partially overlapping eachother via the component assembly (CA), thereby helping to utilize thespace of arrangement of other electronic components (e.g., the antenna Rof FIG. 9A). According to an embodiment, the opening 3701 extendingthrough the third side surface 2113 to accommodate the socket tray 400may be covered from the outside via the sixth side surface 2213 in aslide-in state, thereby helping to form a beautiful appearance of theelectronic device 200. In an embodiment, the socket module 370 may bereplaced with an IF connector port which is fine even when used only ina slide-out state.

FIG. 20 is an exploded perspective view of a first housing including acomponent assembly according to various embodiments.

Referring to FIG. 20 , the component assembly (CA) may be disposed inthe first space (e.g., a first space 2101 of FIG. 22 ) of the firsthousing 210, configured via a coupling of the first bracket housing 210a and the second bracket housing 210 b. According to an embodiment, thecomponent assembly (CA) may include a camera module 216 and a socketmodule 370 disposed in a stacked manner with the camera module 216.According to an embodiment, when the first support member 212 is viewedfrom above, the component assembly (CA) may be disposed to allow thecamera module 216 to at least partially overlap the socket module 370.The socket module 370 may be disposed at a position to face the opening3701 extending through the third side surface (e.g., the third sidesurface 2113 of FIG. 19B), in the first housing 210.

FIGS. 21A, 21B and 21C are perspective views illustrating an assemblingoperation of a component assembly according to various embodiments. FIG.22 is a partial cross-sectional view of the electronic device takenalong line 22-22 of FIG. 18A according to various embodiments.

Referring to FIGS. 21A, 21B and 21C, in an embodiment, the componentassembly (CA) may include a socket module 370 and a camera module 216coupled in a stacked manner with the socket module 370. According to anembodiment, the socket module 370 may include a substrate 371 includinga connector 3711 and a socket base 372 disposed on the substrate 371.According to an embodiment, the component assembly (CA) may include areinforcing plate 380 disposed between the camera module 382 and thesubstrate 371 of the socket module 370. According to an embodiment, thereinforcing plate 380 may help to reinforce rigidity of the componentassembly (CA) and may reduce performance deterioration of the cameramodule 216 by performing a shielding action. In an embodiment, thereinforcing plate 380 may firmly fix the electronic components of thecomponent assembly (CA) and may provide a fixing structure with thefirst housing (e.g., the first housing 210 of FIG. 20 ). In anembodiment, the reinforcing plate 380 may provide a heat transferstructure (e.g., a heat dissipation structure) which diffuses heatproduced from the electronic components of the component assembly (CA).According to an embodiment, the reinforcing plate 380 may include analignment protrusion 381 protruding in a predetermined shape from theouter surface to provide a fixing position of the socket module 370.According to an embodiment, the reinforcing plate 380 may be configuredof a metal material. According to an embodiment, the socket module 370and the camera module 216 may be fixed to the reinforcing plate 380 viaadhesive members 382 and 383 (e.g., double-sided tape). In anembodiment, the socket module 370 and the camera module 216 may be fixedto the reinforcing plate 380 via ultrasonic fusion or structuralbonding.

Referring to FIG. 22 , in a case where the component assembly (CA) isdisposed in the first space 2101 (e.g., the first sub-space A) of thefirst housing 210, the camera module 216 may face the first rear surfacecover 213 and the socket module 370 may face the first support member212. The electronic device 200 may further include an intermediatemember 373 disposed between the socket module 370 and the first supportmember 212. According to an embodiment, the intermediate member 373 maybe disposed to be substantially in contact with a conductive portion ofthe first support member 212 and the socket module 370. According to anembodiment, the intermediate member 373 may include a conductive buffermember configured to ground the socket member 370 to the first housing210 and perform a buffering operation. According to an embodiment, theconductive buffer member may include at least one of a conductivesponge, a conductive tape, or a conductive adhesive. According to anembodiment, the intermediate member 373 may include a heat transfermember configured to diffuse heat produced from the socket module 370and/or the camera module 216 to the first housing 210. According to anembodiment, the heat transfer member may include a thermal interfacematerial (TIM). In an embodiment, the intermediate member 373 may bereplaced with a material capable of performing all of a bufferingaction, a shielding action, and a heat transfer action.

According to various example embodiments, an electronic device (e.g.,the electronic device 200 in FIG. 3A) may include: a first housing(e.g., the first housing 210 in FIG. 3A) having a first space (e.g., thefirst space 2101 in FIG. 5A) formed through a first lateral portion(e.g., the first lateral member 211 in FIG. 3A) including a first sidesurface (e.g., the first side surface 2111 in FIG. 3A), a second sidesurface (e.g., the second side surface 2112 in FIG. 3A) extending in adirection perpendicular to the first side surface, and a third sidesurface (e.g., the third side surface 2113 in FIG. 3A) extending fromthe second side surface parallel to the first side surface; a secondhousing (e.g., the second housing 220 in FIG. 3A) slidably combined withthe first housing along a first direction (e.g., direction {circlearound (1)} in FIG. 3A) and having a second space (e.g., the secondspace 2201 in FIG. 5A) formed through a second lateral portion (e.g.,the second lateral member 221 in FIG. 3A); a bendable support (e.g., thebendable member 240 in FIG. 5A) connected to the first housing,accommodated at least in part in the second space in a slide-in state,and coplanar at least in part with the first housing in a slide-outstate; a flexible display (e.g., the flexible display 230 in FIG. 3A)including a first portion (e.g., the first portion 230 a in FIG. 3A)disposed to be visible from outside in the slide-in state, and a secondportion (e.g., the second portion 230 b in FIG. 3A) extending from thefirst portion and accommodated in the second space through the bendablemember so as not to be visible at least in part from the outside; atleast one electronic component (e.g., the speaker 207 in FIG. 15B)disposed in the second space and in communication with an externalenvironment through a first opening (e.g., the second speaker hole 207 bin FIG. 15B) formed in at least a part of the second lateral member inthe slide-in state; and a bendable electrical connection membercomprising a conductor (e.g., the bendable FPCB 2071 in FIG. 15B)connecting the electronic component to the first space. At least a partof the first and third side surfaces may be accommodated in the secondspace in the slide-in state so as not to be visible from the outside,and the at least one electronic component may be disposed at a positionnot subject to interference from the first side surface and/or thesecond side surface in the slide-in state.

According to various example embodiments, in the slide-out state, thesecond portion of the flexible display may be supported by the bendablesupport and visible at least in part from the outside.

According to various example embodiments, the first housing may includea first support extending from the first lateral portion to the firstspace, the second housing may include a second support extending fromthe second lateral portion to the second space, and at least a part ofthe first support and at least a part of the second support may beconfigured to be slidably combined with each other.

According to various example embodiments, the second lateral portion mayinclude a fourth side surface corresponding to at least a part of thefirst side surface, a fifth side surface extending from the fourth sidesurface and disposed parallel to the second side surface, and a sixthside surface extending from the fifth side surface and corresponding toat least a part of the third side surface, and in the slide-in state,the first side surface may be hidden by the fourth side surface, and thethird side surface may be hidden by the sixth side surface.

According to various example embodiments, the first opening may beformed through the fourth side surface, and the at least one electroniccomponent may be fastened through at least one fastener in the secondspace so as to face the first opening.

According to various example embodiments, the at least one fastener mayinclude at least one screw.

According to various example embodiments, the electronic device mayfurther include a first lateral cover disposed on the fourth sidesurface and having a second opening formed at a position correspondingto the first opening.

According to various example embodiments, the second opening may havesubstantially a same size and shape as the first opening.

According to various example embodiments, the electronic device mayfurther include a seal disposed between the fourth side surface and thefirst lateral cover to surround the first opening and the secondopening.

According to various example embodiments, the seal may include at leastone of sponge, rubber, urethane, and silicone.

According to various example embodiments, the first housing may furtherinclude an accommodating portion formed in the first space configured toaccommodate the at least one electronic component in the slide-in state.

According to various example embodiments, the accommodating portion maybe provided through a structural shape of the first support.

According to various example embodiments, the bendable electricalconnection member may include a flexible printed circuit board (FPCB).

According to various example embodiments, the electronic device mayfurther include a main substrate disposed in the first space, asub-substrate spaced apart from the main substrate, and a connectioncable electrically connecting the sub-substrate and the main substrate,and the bendable electrical connection member may be electricallyconnected to the sub-substrate.

According to various example embodiments, the at least one electroniccomponent may include at least one of a speaker, a microphone, an IFconnector port, a sensor module, or a socket module.

According to various example embodiments, the electronic device mayfurther include a receiver disposed in the first space in communicationwith the outside through a third opening formed on the third sidesurface of the first housing, wherein in the slide-in state, the thirdopening may be hidden through at least a part of the second housing soas not to be seen from the outside.

According to various example embodiments, in the slide-in state, thethird opening and at least a part of the second housing may be spacedapart from each other.

According to various example embodiments, in the slide-out state, atleast a part of the third opening may be disposed at a position visiblefrom the outside.

According to various example embodiments, the second lateral portion mayinclude a fourth side surface facing at least a part of the first sidesurface, a fifth side surface extending from the fourth side surface anddisposed parallel to the second side surface, and a sixth side surfaceextending from the fifth side surface and facing at least a part of thethird side surface, and the sixth side surface may be hidden at least inpart through the second lateral cover so as not to be seen from theoutside.

According to various example embodiments, in the slide-in state, thethird opening may be hidden by a bent portion bent from the secondlateral cover.

While the disclosure has been illustrated and described with referenceto various example embodiments, it will be understood that the variousexample embodiments are intended to be illustrative, not limiting. Itwill be further understood by one skilled in the art that variouschanges in form and detail may be made without departing from the truespirit and full scope of the disclosure, including the appended claimsand their equivalents. It will also be understood that any of theembodiment(s) described herein may be used in conjunction with any otherembodiment(s) described herein.

What is claimed is:
 1. An electronic device comprising: a first housing;a second housing slidably coupled to the first housing based on aslide-in state or slide-out state of the second housing; a flexibledisplay including a first portion disposed to be visible from outside inthe slide-in state, and a second portion extending from the firstportion based on the slide-out state of the second housing and receivedin an inner space of the first housing in the slide-in state; and abendable support connected to the first housing and supporting thesecond portion of the flexible display in the slide-out state.
 2. Theelectronic device of claim 1, wherein in the slide-out state, the secondportion of the flexible display is supported by the bendable support andvisible at least in part from the outside.
 3. The electronic device ofclaim 1, wherein the first housing includes a first space formed througha first lateral member including a first side surface, a second sidesurface extending in a direction perpendicular to the first sidesurface, and a third side surface extending parallel to the first sidesurface from the second side surface, the first housing including afirst support extending from the first lateral member to the firstspace, wherein the second housing includes a second space formed througha second lateral member, the second housing including a second supportextending from the second lateral member to the second space, wherein atleast a part of the first support and at least a part of the secondsupport are configured to be slidably combined with each other, andwherein the electronic device further comprising: at least oneelectronic component disposed in the second space and in communicationwith an external environment through a first opening formed in at leasta part of the second lateral member in the slide-in state; and abendable electrical connection member configured to connect theelectronic component to the first space, wherein at least a part of thefirst and third side surfaces is accommodated in the second space in theslide-in state so as not to be visible from the outside, and wherein theat least one electronic component is disposed at a position not subjectto interference from the first side surface and/or the second sidesurface in the slide-in state.
 4. The electronic device of claim 3,wherein the second lateral member includes a fourth side surfacecorresponding to at least a part of the first side surface, a fifth sidesurface extending from the fourth side surface and disposed parallel tothe second side surface, and a sixth side surface extending from thefifth side surface and corresponding to at least a part of the thirdside surface, and wherein in the slide-in state, the first side surfaceis hidden by the fourth side surface, and the third side surface ishidden by the sixth side surface.
 5. The electronic device of claim 4,wherein the first opening is formed through the fourth side surface, andthe at least one electronic component is fastened through at least onefastener in the second space to face the first opening.
 6. Theelectronic device of claim 5, further comprising: a first lateral coverdisposed on the fourth side surface and having a second opening formedat a position corresponding to the first opening.
 7. The electronicdevice of claim 6, wherein the second opening has substantially a samesize and shape as the first opening.
 8. The electronic device of claim6, further comprising: a seal disposed between the fourth side surfaceand the first lateral cover to surround the first opening and the secondopening.
 9. The electronic device of claim 3, wherein the first housingfurther includes an accommodating portion formed in the first space andconfigured to accommodate the at least one electronic component in theslide-in state.
 10. The electronic device of claim 9, wherein theaccommodating portion is provided through a structural shape of thefirst support.
 11. The electronic device of claim 3, further comprising:a main substrate disposed in the first space; a sub-substrate spacedapart from the main substrate; and a connection cable electricallyconnecting the sub-substrate and the main substrate, wherein thebendable electrical connection member is electrically connected to thesub-substrate.
 12. The electronic device of claim 3, wherein the atleast one electronic component includes at least one of a speaker, amicrophone, an interface (IF) connector port, a sensor module, or asocket module.
 13. The electronic device of claim 3, further comprising:a receiver disposed in the first space and in communication with theoutside through a third opening formed on the third side surface of thefirst housing, wherein in the slide-in state, the third opening ishidden through at least a part of the second housing so as not to beseen from the outside.
 14. The electronic device of claim 13, wherein inthe slide-in state, the third opening and at least a part of the secondhousing are spaced apart from each other.
 15. The electronic device ofclaim 13, wherein in the slide-out state, at least a part of the thirdopening is disposed at a position visible from the outside.
 16. Theelectronic device of claim 5, wherein the at least one fastener includesat least one screw.
 17. The electronic device of claim 8, wherein theseal includes at least one of sponge, rubber, urethane, and silicone.18. The electronic device of claim 3, wherein the bendable electricalconnection member includes a flexible printed circuit board (FPCB). 19.The electronic device of claim 13, wherein the second lateral portionincludes a fourth side surface facing at least a part of the first sidesurface, a fifth side surface extending from the fourth side surface anddisposed parallel to the second side surface, and a sixth side surfaceextending from the fifth side surface and facing at least a part of thethird side surface, and the sixth side surface may be hidden at least inpart through the second lateral cover so as not to be seen from theoutside.
 20. The electronic device of claim 19, wherein in the slide-instate, the third opening is configured to be hidden by a bent portionbent from the second lateral cover.